Component protective overmolding using protective external coatings

ABSTRACT

Techniques for component protective overmolding using protective external coatings include selectively applying a protective material substantially over one or more elements coupled to a framework configured to be worn, the elements including at least a sensor, and forming one or more moldings substantially over a subset or all of the framework, the protective material and the elements, after the protective material has been selectively applied, at least one of the one or more moldings having a protective property.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of copending U.S. patent applicationSer. No. 13/942,503, filed Jul. 15, 2013 (Attorney Docket No.ALI-001CIP1CIP1CON1CON1), entitled, “Component Protective OvermoldingUsing Protective External Coatings,” which is a continuation of U.S.patent application Ser. No. 13/427,839, filed Mar. 22, 2012 (AttorneyDocket No. ALI-001CIP1CIP1CON1), entitled “Component ProtectiveOvermolding Using Protective External Coatings,” which is a continuationof U.S. patent application Ser. No. 13/135,728, filed Jul. 12, 2011(Attorney Docket No. ALI-001CIP1CIP1), entitled “Component ProtectiveOvermolding Using Protective External Coatings,” which is acontinuation-in-part of U.S. patent application Ser. No. 13/158,416,filed Jun. 11, 2011 (Attorney Docket No.: ALI-001CIP1), entitled“Component Protective Overmolding,” which is a continuation-in-part ofU.S. patent application Ser. No. 13/158,372, filed Jun. 10, 2011(Attorney Docket No.: ALI-001), entitled “Component ProtectiveOvermolding,” all of which are hereby incorporated by reference inentirety for all purposes.

FIELD

The present invention relates generally to electrical and electronichardware, computer software, wired and wireless network communications,and computing devices. More specifically, techniques for componentprotective overmolding using protective external coatings are described.

BACKGROUND

With the advent of greater computing capabilities in smaller mobile formfactors and an increasing number of applications (i.e., computer andInternet software or programs) for different uses, consumers (i.e.,users) have access to large amounts of data, personal or otherwise.Information and data are often readily available, but poorly capturedusing conventional data capture devices. Conventional devices typicallylack capabilities that can record, store, analyze, communicate, or usedata in a contextually-meaningful, comprehensive, and efficient manner.Further, conventional solutions are often limited to specific individualpurposes or uses, demanding that users invest in multiple devices inorder to perform different activities (e.g., a sports watch for trackingtime and distance, a GPS receiver for monitoring a hike or run, acyclometer for gathering cycling data, and others). Although a widerange of data and information is available, conventional devices andapplications generally fail to provide effective solutions thatcomprehensively capture data for a given user across numerous disparateactivities.

Some conventional solutions combine a small number of discretefunctions. Functionality for data capture, processing, storage, orcommunication in conventional devices such as a watch or timer with aheart rate monitor or global positioning system (“GPS”) receiver areavailable, but are expensive to manufacture and typically requirepurchasing multiple, expensive devices. Other conventional solutions forcombining data capture facilities often present numerous design andmanufacturing problems such as size specifications, materialsrequirements, lowered tolerances for defects such as pits or holes incoverings for water-resistant or waterproof devices, unreliability,higher failure rates, increased manufacturing time, and expense.Subsequently, conventional devices such as fitness watches, heart ratemonitors, GPS-enabled fitness monitors, health monitors (e.g., diabeticblood sugar testing units), digital voice recorders, pedometers,altimeters, and other conventional data capture devices are generallymanufactured for conditions that occur in a single or small groupings ofactivities and, subsequently, are limited in terms of commercial appealto consumers.

Generally, if the number of data inputs accessible by conventional datacapture devices increases, there is a corresponding rise in design andmanufacturing requirements and device size that results in significantconsumer expense and/or decreased consumer appeal, which eventuallybecomes prohibitive to both investment and commercialization. Stillfurther, conventional manufacturing techniques are often limited andineffective at meeting increased requirements to protect sensitivehardware, circuitry, and other components that are susceptible todamage, but which are required to perform various data captureactivities. As a conventional example, sensitive electronic componentssuch as printed circuit board assemblies (“PCBA”), sensors, and computermemory (hereafter “memory”) can be significantly damaged or destroyedduring manufacturing processes where protective overmoldings or layersof material occurs using techniques such as injection molding, coldmolding, and others. Damaged or destroyed items subsequently raises thecost of goods sold and can deter not only investment andcommercialization, but also innovation in data capture and analysistechnologies, which are highly compelling fields of opportunity.

Thus, what is needed is a solution for efficiently manufacturing deviceswithout the limitations of conventional techniques.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments or examples (“examples”) are disclosed in thefollowing detailed description and the accompanying drawings:

FIG. 1 illustrates a cross-sectional view of an exemplary process forproviding protective material in component protective overmolding;

FIG. 2 illustrates another cross-sectional view of an exemplary processfor providing protective material in component protective overmolding;

FIG. 3 illustrates a cross-sectional view of an exemplary process forforming an inner molding in component protective overmolding;

FIG. 4 illustrates another cross-sectional view of an exemplary processfor forming an outer molding in component protective overmolding;

FIG. 5A illustrates an exemplary design applied during componentprotective overmolding;

FIG. 5B illustrates another exemplary design applied during componentprotective overmolding;

FIG. 5C illustrates a further exemplary design applied during componentprotective overmolding;

FIG. 6A illustrates an exemplary process for component protectiveovermolding;

FIG. 6B illustrates an alternative exemplary process for componentprotective overmolding;

FIG. 6C illustrates another alternative exemplary process for componentprotective overmolding;

FIG. 6D illustrates yet another alternative exemplary process forcomponent protective overmolding;

FIG. 7 illustrates a view of an exemplary data-capable strapbandconfigured to receive overmolding;

FIG. 8 illustrates a view of an exemplary data-capable strapband havinga first molding;

FIG. 9 illustrates a view of an exemplary data-capable strapband havinga second molding;

FIG. 10 illustrates an exemplary process for component protectiveovermolding using protective external coatings;

FIG. 11 illustrates an alternative exemplary process for componentprotective overmolding using protective external coatings; and

FIG. 12 illustrates another alternative exemplary process for componentprotective overmolding using protective external coatings.

DETAILED DESCRIPTION

Various embodiments or examples may be implemented in numerous ways,including as a system, a process, an apparatus, a user interface, or aseries of program instructions on a computer readable medium such as acomputer readable storage medium or a computer network where the programinstructions are sent over optical, electronic, or wirelesscommunication links. In general, operations of disclosed processes maybe performed in an arbitrary order, unless otherwise provided in theclaims.

A detailed description of one or more examples is provided below alongwith accompanying figures. The detailed description is provided inconnection with such examples, but is not limited to any particularexample. The scope is limited only by the claims and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the following description in order toprovide a thorough understanding. These details are provided for thepurpose of example and the described techniques may be practicedaccording to the claims without some or all of these specific details.For clarity, technical material that is known in the technical fieldsrelated to the examples has not been described in detail to avoidunnecessarily obscuring the description.

FIG. 1 illustrates a cross-sectional view of an exemplary process forproviding protective material in data-capable strapband overmolding.Here, device 100 includes framework 102, elements 104-106, and covering108. In some examples, framework 102 may be referred to interchangeablyas a substrate, wafer, board (printed, unprinted, or otherwise), orother surface upon which elements 104-106 may be mounted, placed, orotherwise fixed. The type and configuration of elements may be variedand are not limited to any given type of electrical, electronic, ormechanical component. For example, element 104 may be implemented as amicrovibrator or motor configured to provide a vibratory signal for analarm or other indicator. Element 104 may also be a printed circuitboard assembly (“PCBA”), logic, processor, microprocessor, memory (e.g.,solid state, RAM, ROM, DRAM, SDRAM, or others), or other computingelement and is not limited to any specific type of component. Further,element 104 may be coupled electrically or electronically to element106, which may also be an electrical, electronic, or mechanicalcomponent that can be placed on framework 102. When placed on framework102, elements 104-106 may be fixed using various techniques, includingadhesives, mechanical fixing structures (e.g., posts and holes), orothers, without limitation.

As shown, covering 108 may be placed over element 104 in order toprotect the latter from damage resulting from the application ofsubsequent layers, coverings, moldings, or other protective material,regardless of environmental conditions (e.g., temperature, pressure,thickness, and others). As shown, element 104 is covered by covering 108and element 106 is uncovered. However, other protective materials may beused to cover element 106. In still other examples, protective materialssuch as covering 108 may not be used if elements 104 or 106 aremanufactured to resist the formation, deposit, layering, or covering ofother protective materials at various temperatures, pressures, or otheratmospheric conditions. In other examples, device 100 and theabove-described elements may be varied and are not limited to thoseshown and described.

FIG. 2 illustrates another cross-sectional view of an exemplary processfor providing protective material in data-capable strapband overmolding.Here, device 200 includes framework 102, elements 104-106, covering 108,syringe 202, arrows 204-206, and protective coating 208. In someexamples, covering 108 and protective coating 208 may be referred to as“protective material” interchangeably and without limitation. As shown,like numbered elements shown in this drawing and others may refer to thesame or a substantially similar element previously described.

In some examples, an applicator (e.g., syringe 202) may be used toselectively apply protective coating 208 to cover as a protective layerover element 106. As used herein, “selectively applying” may refer tothe application, placement, positioning, formation, deposition, growth,or the like, of protective material to one, some, all, or none of anyunderlying elements (e.g., elements 104-106). In some examples,“protective material” may also be used interchangeably with “protectivelayer,” “covering,” “housing,” or “structure” regardless of thecomposition of material or matter used, without limitation. In otherwords, covering 108 and protective coating 208 may each be referred toas “protective material” and used to protect underlying elements (e.g.,elements 104-106 (FIG. 1)) as described herein.

When the plunger of syringe 202 is depressed in the direction of arrow204, protective coating 208 is forced through applicator tip 210 andapplied as a protective layer over element 106. As an example,protective coating 208 may be applied at substantially atmosphericpressure by applying 1-2 psi of pressure to the plunger of syringe 202.When applied, protective coating 208 may be, for example, an ultraviolet(“UV”) curable adhesive or other material. In other words, whenprotective coating 208 is applied (i.e., layered over element 106) andexposed to ultraviolet radiation (or other curing conditions) at levelssimilar to those found in natural sunlight or artificial light, itcoalesces and hardens into a covering that prevents the underlyingelement (e.g., element 106) from being damaged when other protectivematerials or layers are applied such as those shown and described below.Exemplary types of protective coating 208 may include coatings,adhesives, gels, liquids, or any other type of material that hardens toprotect, prevent, minimize, or otherwise aid in avoiding damage to aprotected element. Examples of UV curable coatings include Loctite®coatings produced by Henkel & Co AG of Dusseldorf, Germany such as, forexample, Loctite® 5083 curable coating. Other types of curable coatings,in addition to those that are UV curable, may be used to protectunderlying elements without limitation or restriction to any given type.

In some examples, protective material such as Loctite® or others may beapplied selectively to one, some, or all electrical, electronic,mechanical, or other elements. Protective coating 208 may also beapplied in different environmental conditions (e.g., atmosphericpressure, under vacuum, in a molding cavity or chamber, within adeposition chamber, or the like) and is not limited to the examplesshown and described. As shown, protective coating 208 has beenselectively applied to element 106, but not element 104, the latter ofwhich is being protected by covering 108. As an alternative, covering108 may be used as protective material in the form of an enclosure orphysical structure that is used to protect an underlying element. Asdescribed herein, protective coating 208 may be selectively applied bydetermining whether sensitive components, parts, or other elements(“elements”) are susceptible to damage or destruction from subsequentprocesses, for example, to deposit additional protective layers, such asthose described in greater detail below. In other examples, device 200and the above-described elements may be varied in function, structure,configuration, implementation, or other aspects and are not limited tothose provided.

FIG. 3 illustrates a cross-sectional view of an exemplary process forforming an inner molding in data-capable strapband overmolding. Here,device 300 includes framework 102, elements 104-106, covering 108,syringe 202, arrows 204-206, protective coating 208, mold cavity 302,nozzle 304, arrows 306-310, and inner molding 312. In some examples,framework 102 and elements 104-106 having selectively applied protectivecoating 208 may be placed in mold cavity 302 where another protectivelayer or coating (e.g., inner molding 312) may be applied from nozzle304 in the direction of arrows 306-310. Types of materials that may beused for inner molding 312 include plastics, thermoplastics,thermoplastic elastomers, polymers, elastomers, or any other organic orinorganic material that can molded in mold cavity 302. As shown, moldcavity 302 may be implemented using a variety of molding techniques. Forexample, an injection molding machine may be used to inject athermoplastic polymer elastomer (“TPE”) into mold cavity 302. Wheninjected under temperature (e.g., 400 to 460 degrees Fahrenheit) andpressure (e.g., 200 to 600 psi, but which may be adjusted to higher orlower pressure, without limitation), inner molding 208 forms aprotective layer around framework 102, elements 104-106, covering 108,protective coating 208, providing a layer of additional protectivematerial (e.g., inner molding 312), which may completely or incompletelysurround an object (e.g., framework 102). In some examples, innermolding 312 may be formed to provide a watertight or hermetic sealaround framework 102 and elements 104-106. Types of materials that maybe used as inner molding 312 include TPEs such as Versaflex 9545-1 asmanufactured by PolyOne Corporation of McHenry, Ill. Other types ofmaterials such as epoxies, polymers, elastomers, thermoplastics,thermoplastic polymers, thermoplastic polymer elastomers, and others maybe used to form inner molding 312, without limitation to a specificmaterial. In other examples, device 300 and the above-described elementsmay be varied in function, structure, configuration, implementation, orother aspects and are not limited to those provided.

FIG. 4 illustrates another cross-sectional view of an exemplary processfor forming an outer molding in data-capable strapband overmolding.Here, device 400 includes framework 102, elements 104-106, covering 108,syringe 202, arrows 204-206, protective coating 208, inner molding 312,mold cavity 402, nozzle 404, arrows 406-410, and outer molding 412. Insome examples, mold cavity 402 may be the same or different from thatdescribed above in connection with FIG. 3. In other words, mold cavity402 may be the same mold cavity as mold cavity 302, but which is used toinjection mold outer molding 412. As shown, framework 102, elements104-106, protective coating 208, and inner molding 312 are placed inmold cavity 402. Material (e.g., TPE) may be injected through nozzle 404in the direction of arrows 406-410 into mold cavity 402 in order to formouter molding 412. Once formed, sprue or other extraneous material maybe present in inner molding 312 or outer molding 412, which may beremoved after device 400 is taken out of molding cavity 402. A visualinspection, in some examples, may be performed to determine if defectsare present in either inner molding 312 or outer molding 412. If defectsare found in outer molding 412, then removal may occur and a new outermolding may be formed using mold cavity 402. The inspection and, ifdefects are found, the removal of outer molding 412 allows for higherquality moldings to be developed at a lower cost without requiring thediscarding of sensitive, expensive electronics. Outer molding 412, insome examples, may also be used to provide surface ornamentation to agiven object. The use of thermoplastics or TPE material may be used toform outer molding 412 and to provide material in which a surfacetexture, design, or pattern may be imprinted, contoured, or otherwiseformed. In so doing, various types of patterns, designs, or textures maybe formed of various types. For example, miniature “hills” and “valleys”may be formed in the protective material of outer molding 412 in orderto produce a “denim” feel or texture to a given object. Examples ofdifferent patterns for outer molding 412 may be found in FIGS. 5A-5C, asshown by patterns 502, 512, and 522, respectively. Patterns 502, 512,and 522 are provided for purposes of illustration and are neitherlimiting nor restrictive with regard to the types, patterns, designs, ortextures of surface ornamentation that may be applied to outer molding412, as described herein. Protective material (e.g., TPE) injected intomold cavity 402 may be used to form these patterns. Various types ofinjection molding processes and equipment may be used and are notlimited to any specific type, make, manufacture, model, or otherspecification.

Referring back to FIG. 4, the use of the described techniques allows formore precise tolerances in forming moldings that are form-fitting tovarious types of devices. Still further, the use of the above-describedtechniques also allows for relatively small devices having sensitiveelectronics to be subjected to harsh environmental conditions duringmolding processes in order to form protective layers (e.g., innermolding 312, outer molding 412) over various types of devices. As shownand described, the disclosed techniques may be used on a variety ofdevices, without limitation or restriction. In other examples, device400 and the above-described elements may be varied in function,structure, configuration, implementation, or other aspects and are notlimited to those provided.

FIG. 6A illustrates an exemplary process for component protectiveovermolding. Here, the start of process 600 includes forming aprotective layer on, for example, framework 102 (FIG. 1) (602). In someexamples, a protective layer may refer to protective material, layers,or covers such as protective material 108 (FIG. 2) or structures thatare formed to protect underlying elements (e.g., covering 108 (FIG. 1).Examples of material that may be used to form a protective layer includeUV curable materials such as those described above, including coatings,adhesives, liquids, gels, and others that cure when exposed toultraviolet radiation in various concentrations and exposure levelswithout limitation. After forming a protective layer (e.g., protectivecoating 208), an inner molding (e.g., inner molding 312 (FIG. 3)) isformed (604). After forming an inner molding, a function test isperformed to determine whether the inner molding and protective layerhave damaged the underlying item (606). In some examples, a functiontest may be performed as part of an inspection and include applying anelectrical current to an underlying electronic element to identifyproper voltage or current flow or other parameters that indicate whetherdamage has occurred during the formation of a protective layer, an innermolding, or, in other examples, an outer molding. Inspections may beperformed at various stages of the manufacturing process in order toidentify defects early and reduce costs incurred with re-applyingprotective layers or moldings. In other examples, a function test may beperformed to determine whether the inner molding has sufficiently coateddesired underlying items (e.g., electrical, electronic, mechanical, orany structure or elements thereof that are being protected from damageusing one or more moldings). In still further examples, the functiontest may be performed to determine whether the formation of an innermolding damaged underlying items that were previously protected by theformation of protective layer, the latter of which may be performedoutside of a mold device or cavity (e.g., mold cavity 302 (FIG. 3) ormold cavity 402 (FIG. 4)) at room temperature and/or atmosphericconditions, including atmospheric or ambient temperatures, pressures,and humidity levels, without limitation.

In some examples, a determination is made as to whether a function testis passed or failed (608). Here, if an item having a protective layerand an inner molding fails to pass, the item is rejected and the processends (610). Alternatively, if an item (e.g., framework 102 and elements106-108 (FIG. 1)) fails to pass a function test due to the presence ofone or more defects, the inner molding may be removed and re-applied. Inother examples, the underlying item may be rejected (i.e., destroyed,recycled, or otherwise removed from a lot of items that havesuccessfully passed a function test). If a determination is made that afunction test has passed as part of an inspection, then an outer moldingis formed over the inner molding and protective layer (612).

In some examples, the protective layer, inner molding, and outer moldingmay be selectively, partially, or completely applied to a given item. Asdescribed here, an outer molding may also be configured to completelyenclose or encase an underlying item in order to protect the innermolding, the protective layer, and any elements from damage. Further,outer molding may be used to form patterns, designs, or other surfacefeatures or contours for usable, functional, or aesthetic purposes. Asshown here, after an outer molding is formed, a final test is performedto determine whether defects are present or the formation of the outermolding met desired parameters (e.g., did the outer molding fully coatan item, were any underlying items damaged, and the like) (614). In someexamples, a final test may also be a function test, as described above.In other examples, a final test may also evaluate an item coated with anouter molding for other purposes. If the final test is not passed, thenthe item may be rejected and, in some examples, the outer molding may beremoved and re-applied (i.e., re-formed) (610). In other example, afailed final test may also result in the item being rejected anddestroyed, recycled, or otherwise handled as unacceptable. Finally,after a final test is performed a visual inspection may be performed todetermine whether an item has been covered by the formed outer moldingas desired (618). In other examples, process 600 may be implementeddifferently in the order, function, configuration, or other aspectsdescribed and is not limited to the examples shown and described above.

FIG. 6B illustrates an alternative exemplary process for componentprotective overmolding. Here, process 620 beings be selectively applyingprotective material (e.g., protective coating 208 (FIG. 2)) to one ormore elements (e.g., electrical, electronic, mechanical, structural, orothers) (622). In some examples, selectively applying protectivematerial may include manually using an applicator (e.g., syringe 202(FIG. 2) or any other type of instrument, device, tool, or implementused to apply protective material) to deposit a layer, covering,coating, or the like over a desired element. In other examples,selectively applying may also include the application of protectivematerial to one, some, all, or none of the elements present on a givenitem. In other words, selectively applying protective material may beperformed uniformly or non-uniformly without limitation. Types ofprotective materials may include curable or non-curable materials suchas those described above, including UV-curable coatings that, whenexposed to ultraviolet radiation, cure. In other examples, other typesof coatings may be used that, when exposed to artificial or man-madeconditions, cure. Still further, other types of coatings may be used toform a protective layer (i.e., protective material) over sensitiveelements that may require the combination of two or more materials,chemicals, or compounds, such as epoxies, polymers, elastomers, and thelike, without limitation.

Here, after selectively applying protective material an inner molding isformed over a framework, associated elements (i.e., elements coupled tothe framework), and the previously, selectively-applied protectivematerial (624). As an example of a framework, a “strapband” or, as usedherein, “band” may refer to a wearable device that is configured forvarious data capture, analysis, communication, and other purposes. Insome examples, a band may refer to a wearable personal data capturedevice that, when worn, may be used to record and store various types ofdata associated with a given person's motion, behavior, and physicalcharacteristics (e.g., body temperature, salinity, blood sugar, heartrate, respiration rate, movement, and many others, without limitation).In other examples, a band may be implemented using hardware, software,and firmware, where application-specific programs may be downloaded ontoa memory that is included as an element and protected using thedescribed overmolding processes. A band may be implemented as describedbelow in connection with FIGS. 7-9.

Referring back to FIG. 6B, an outer molding is formed over the innermolding, the framework, its elements, and the protective material (626).After the outer molding is formed, an inspection of the outer molding isperformed to determine whether a defect is present (628). As usedherein, an inspection may refer to any type of process (e.g., automatic,semi-automatic, manual, robotic, visual, structural, radiological,electrical, or others) that is used to determine whether a defect ispresent. In some examples, an inspection may include one or morefunction (i.e., functional) tests to determine whether a coated (i.e.,item receiving protective material and protective layers or coatings)has been damaged during the layering process. If a defect (e.g., adamaged item or defective molding) is found, then the outer molding isremoved (632) and formed again over the inner molding, framework,elements, and protective material (626). If no defect is found, then theprocess ends. Examples of materials that may be used for moldings (e.g.,inner molding, outer molding) in process 620 include plastics,thermoplastics, thermoplastic elastomers, polymers, thermoplasticpolymer elastomers, epoxies, alloys, metals, or any other type oforganic or synthetic material, without limitation. In other examples,process 620 may be implemented differently in the order, function,configuration, or other aspects provided and is not limited to theexamples shown and described above.

FIG. 6C illustrates another alternative exemplary process for componentprotective overmolding. Here, an alternative 2-stage process 640 forcomponent protective overmolding may be performed. First, selectiveapplication of a securing coating over components placed on, forexample, a framework, may be performed (642). As used herein, a securingcoating may refer to any type of protective material, layer, cover,structure, liquid, gel, solid, or the like that is placed substantially(i.e., partially or entirely) over an item in order to prevent damagefrom later stages of a manufacturing process (e.g., introduction intomold cavity 302 (FIG. 3) or mold cavity 402 (FIG. 4) in which rigoroustemperatures, pressures, or other environmental conditions are createdin order to apply other coated materials. Further, due to the size andrelatively sensitive operating, manufacturing, and performancecharacteristics of various electrical, electronic, mechanical, orstructural features (e.g., microprocessors, solid state computermemories, control logic and circuitry, microvibrators, motors, motorcontrollers, batteries, battery modules, battery controllers, and thelike), the addition of protective material can prevent inadvertentdamage and increased costs occurring during the manufacturing offinished products. As an example, consumer electronics devices receivingboth aesthetic and functional protective overmoldings (i.e., moldings)can be expensive to manufacture because, for each damage underlyingelectronic component, an entire unit must be discarded. However, byusing the described techniques to protect sensitive and expensiveelements by replacing moldings as opposed to entire partially-finisheditems, manufacturing costs can be significantly reduced, thus increasingprofit margins and incentives for individuals and enterprises tocommercially invest in manufacturing devices that can advantageouslycapture, analyze, use, communicate (via wired or wireless datacommunication facilities (e.g., network interface cards (NICs), wirelessradios using various types of wireless data communication protocols forshort, medium, and long-range communication (e.g., Bluetooth™, ZigBee,ANT™, WiFi, WiMax, and others), and the like), or otherwise use valuableand abundant personal data. As an example of these types of devices, astrapband or band may be a wearable device that is configured to capturedata such as that described above. Sensitive elements of various sizesand shapes may be protected from damage occurring during later stages ofprotective overmolding (i.e., application of protective layers, covers,molds, or the like) using the described techniques.

Here, after applying a securing coating, another molding may be formedover the securing coating, band, and components (e.g., elements) (644).As described here and above, the application of one or more moldings maybe performed to both secure and protect underlying items (e.g.,components or elements) of a finished product for various conditionssuch as use, weather, shock, temperature, or other environmentalconditions to which finished products (e.g., band) may be subjected. Inother examples, more, fewer, or different steps may be implemented aspart of process 620 including, for example, a single-stage processinvolving the application of one or more protective layers (e.g.,housings, coverings, securing coatings, coatings, moldings, or thelike). The functions, operations, or processes performed during a singleor multi-stage or step process may be varied, without limitation, toinclude more, fewer, or different types of sub-processes apart fromthose shown and described. Alternatively, more steps in process 620 maybe implemented are not limited to any of the examples shown anddescribed. In still other examples, process 620 may be implementeddifferently in the order, function, configuration, or other aspectsprovided and is not limited to the examples shown and described above.

FIG. 6D illustrates yet another alternative exemplary process forcomponent protective overmolding. Here, process 650 begins by placingone or more elements on a framework (652). In some examples, the one ormore elements may be placed on a part of a framework (not shown) orother support structure configured to provide a substrate or basesupport. Once placed, the elements are coated using a curable material(654). As an example of a curable material, Loctite® 5083 UV curablecoating may be layered (i.e., deposited, poured, injected, layered, orotherwise covered) over the elements and the framework. The curablematerial may be comprehensively, universally, uniformly, semi-uniformly,irregularly, or selectively placed so that some elements are coveredwhile others are left uncovered. Reasons for selectively applying thecurable coating may include other elements being protected from damageduring the molding process using physical structures (e.g., covering108) and yet others being manufactured to withstand the environmentalconditions (e.g., temperature ranges between 400 and 460 degreesFahrenheit and injection nozzle pressures of 200 to 600 pounds persquare inch (psi)) of molding cavity 302 (FIG. 3) or 402 (FIG. 4)without using protective material.

After securing elements to a framework using curable material (e.g., UVcurable coating, which may also be replaced with other types of curablecoating, without limitation or restriction to any specific type), aninspection may be performed to determine whether there are any defects,gaps, openings, or other susceptibilities that can be anticipated beforeapplying the first or inner molding (656). After performing aninspection on the curable coating, one or more moldings may be formedover the curable material (i.e., coating), framework, and elements (658)after which an inspection may be performed to determine whether thereare defects in the molding(s) (660). During the inspection, adetermination is made as to whether a defect has been found in one ormore moldings (662). If a defect is found, the defective molding isremoved (664) and another molding may be reformed over the curablematerial, framework, and elements (666). By enabling a defective moldingto be replaced without requiring the discard of a framework and itsassociated elements (e.g., electrical and electronic components such asmicroprocessors, processors, data storage and computer memory, sensors(e.g., accelerometers, motion/audio/light sensors, velocimeters,pedometers, altimeters, heart rate monitors, barometers,chemical/protein detectors, and others, without limitation), mechanicaland structural features or functionality), substantial costs can besaved thus enabling devices to be produced at lower costs to consumersand business alike. In other examples, process 650 may be implementeddifferently in the order, function, configuration, or other aspectsprovided and is not limited to the examples shown and described above.

FIG. 7 illustrates a side view of an exemplary data-capable strapbandconfigured to receive overmolding. Here, band 700 includes framework702, covering 704, flexible circuit 706, covering 708, motor 710,coverings 714-724, analog audio plug 726, accessory 728, control housing734, control 736, and flexible circuit 738. In some examples, band 700is shown with various elements (i.e., covering 704, flexible circuit706, covering 708, motor 710, coverings 714-724, analog audio plug 726,accessory 728, control housing 734, control 736, and flexible circuit738) coupled to framework 702. Coverings 708, 714-724 and controlhousing 734 may be configured to protect various types of elements,which may be electrical, electronic, mechanical, structural, or ofanother type, without limitation. For example, covering 708 may be usedto protect a battery and power management module from protectivematerial formed around band 700 during an injection molding operation.As another example, housing 704 may be used to protect a printed circuitboard assembly (“PCBA”) from similar damage. Further, control housing734 may be used to protect various types of user interfaces (e.g.,switches, buttons, lights, light-emitting diodes, or other controlfeatures and functionality) from damage. In other examples, the elementsshown may be varied in quantity, type, manufacturer, specification,function, structure, or other aspects in order to provide data capture,communication, analysis, usage, and other capabilities to band 700,which may be worn by a user around a wrist, arm, leg, ankle, neck orother protrusion or aperture, without restriction. Band 700, in someexamples, illustrates an initial unlayered device that may be protectedusing the techniques for protective overmolding as described above.

FIG. 8 illustrates a view of an exemplary data-capable strapband havinga first molding. Here, band 800 includes molding 802, analog audio plug(hereafter “plug”) 804, plug housing 806, button 808, framework 810,control housing 812, and indicator light 814. In some examples, a firstprotective overmolding (i.e., molding 802) has been applied over band700 (FIG. 7) and the above-described elements (e.g., covering 704,flexible circuit 706, covering 708, motor 710, coverings 714-724, analogaudio plug 726, accessory 728, control housing 734, control 736, andflexible circuit 738) leaving some elements partially exposed (e.g.,plug 804, plug housing 806, button 808, framework 810, control housing812, and indicator light 814). However, internal PCBAs, flexibleconnectors, circuitry, and other sensitive elements have beenprotectively covered with a first or inner molding that can beconfigured to further protect band 800 from subsequent moldings formedover band 800 using the above-described techniques. In other examples,the type, configuration, location, shape, design, layout, or otheraspects of band 800 may be varied and are not limited to those shown anddescribed. For example, plug 804 may be removed if a wirelesscommunication facility is instead attached to framework 810, thus havinga transceiver, logic, and antenna instead being protected by molding802. As another example, button 808 may be removed and replaced byanother control mechanism (e.g., an accelerometer that provides motiondata to a processor that, using firmware and/or an application, canidentify and resolve different types of motion that band 800 isundergoing), thus enabling molding 802 to be extended more fully, if notcompletely, over band 800. In yet other examples, molding 802 may beshaped or formed differently and is not intended to be limited to thespecific examples shown and described for purposes of illustration.

FIG. 9 illustrates a view of an exemplary data-capable strapband havinga second molding. Here, band 900 includes molding 902, plug 904, andbutton 906. As shown another overmolding or protective material has beenformed by injection molding, for example, molding 902 over band 900. Asanother molding or covering layer, molding 902 may also be configured toreceive surface designs, raised textures, or patterns, which may be usedto add to the commercial appeal of band 900. In some examples, band 900may be illustrative of a finished data capable strapband (i.e., band 700(FIG. 7), 800 (FIG. 8) or 900) that may be configured to provide a widerange of electrical, electronic, mechanical, structural, photonic, orother capabilities.

Here, band 900 may be configured to perform data communication with oneor more other data-capable devices (e.g., other bands, computers,networked computers, clients, servers, peers, and the like) using wiredor wireless features. For example, a TRRS-type analog audio plug may beused (e.g., plug 904), in connection with firmware and software thatallow for the transmission of audio tones to send or receive encodeddata, which may be performed using a variety of encoded waveforms andprotocols, without limitation. In other examples, plug 904 may beremoved and instead replaced with a wireless communication facility thatis protected by molding 902. If using a wireless communication facilityand protocol, band 900 may communicate with other data-capable devicessuch as cell phones, smart phones, computers (e.g., desktop, laptop,notebook, tablet, and the like), computing networks and clouds, andother types of data-capable devices, without limitation. In still otherexamples, band 900 and the elements described above in connection withFIGS. 1-9, may be varied in type, configuration, function, structure, orother aspects, without limitation to any of the examples shown anddescribed.

FIG. 10 illustrates an exemplary process for component protectiveovermolding using protective external coatings. Here, process 1000includes selectively applying a material (such as those described above)substantially over a framework that is coupled to one or more elements(1002). Selective application of the material, in some examples, mayrefer to point applications of a material (e.g., an epoxy or othermaterial used to protect an underlying element from being damaged duringsubsequent deposition, formation, or molding phases of other material).As used herein, a framework may be an internal substrate, wafer,stiffener, or the like, providing both an internal structure for bands700-900 (FIGS. 7-9) and a structure to which the one or more elementsmay be mounted or coupled, either directly or indirectly. In someexamples, the one or more elements may include any type of electrical,electronic, mechanical, chemical, or other type of device, component,sub-component, mechanism that is configured to receive, transmit,process, or perform a data operation (i.e., “operation”) using datagathered from a sensor coupled to bands 700-900. Also, as used herein,“sensory input” may refer to any type, classification, powered orunpowered, of sensor configured to sense data and information regardingthe internal or external environment of bands 700-900.

After selectively applying the material substantially over the frameworkcoupled to one or more elements, a protective layer is molded over theframework, element(s), and selectively-applied material (1004). Aftermolding the protective layer, a coating may be formed over theprotective layer (1006). In some examples, the coating is formed toprovide a protective property, as described above.

As used herein, “coating” is to be distinguished from protective coating208 (FIG. 2) in that the former is used to provide a protective propertyto the structure to which it is applied. In some examples, theprotective property may include protecting bands 700-900 (FIGS. 7-9)from external damage due to shock, wear, immersion (in various types ofliquids, including water), temperature, pressure, or other environmentalconditions (or lack thereof, including vacuum). In other examples, aprotective property may be a characteristic of a coating that, whenapplied, protects a wearer or users. For example, material used for acoating may include anti-bacterial or medical-grade (i.e., any type ofmaterial or combination of materials, synthetic or organic, that havebeen tested and deemed suitable for biological uses, including thoseinternal and external to organisms or bodies) materials such as TPE,polymers, elastomers, and others. Other protective properties of acoating may include being water-proof, water-resistant, oleophobic,hydrophobic, hardened (i.e., protected from damage due to shock, whichmay require shock or impact-absorbent materials that distribute kineticenergy when applied via force or pressure), ultraviolet radiation(hereafter “UV”)-protective or resistive (i.e., resists color fading),and others, without limitation. Protective properties may refer to anyproperty that protects the framework, elements, material, moldings,coatings, or the like from either external or internal damage orconditions that could result in damage. In other examples, process 1000may be implemented differently in the order, function, configuration, orother aspects provided and is not limited to the examples shown anddescribed above.

FIG. 11 illustrates an alternative exemplary process for componentprotective overmolding using protective external coatings. As analternative process to those described above, material may be provided(e.g., formed, molded, deposited, sprayed, dipped, applied with a brush(i.e., brushed), or the like) over a structure of a device (1102). Insome examples, a device (e.g., bands 700-900 (FIGS. 7-9)) may beconfigured to perform one or more operations, as described above, usingdata received from various types and quantities of sensory inputs. Asused herein, the material may be applied to secure an element (e.g., asensor, battery, motor, detector, circuit, or any other type of element,as described above) to a framework or stiffener of a device. Applyingmaterial may also refer to the molding of a layer of material over aframework and elements, providing a hermetic or substantially hermeticor waterproof enclosure. In other examples, applying material may referto the formation of a single or multiple layers of material over adevice. After applying the material, a coating is formed over it toprovide a protective property, such as those described above (1104). Inother examples, process 1100 may be implemented differently in theorder, function, configuration, or other aspects described and is notlimited to the examples provided above.

FIG. 12 illustrates another alternative exemplary process for componentprotective overmolding using protective external coatings. As a furtheralternative process to those described above, material is selectivelyapplied over a framework coupled to one or more elements (1202). Afterapplying the material over the framework and coupled element(s), one ormore layers (e.g., coatings, such as those described above) are moldedto provide a protective property (1204). In other examples, process 1200may be implemented differently in the order, function, configuration, orother aspects described and is not limited to the examples providedabove.

Although the foregoing examples have been described in some detail forpurposes of clarity of understanding, the above-described inventivetechniques are not limited to the details provided. There are manyalternative ways of implementing the above-described inventiontechniques. The disclosed examples are illustrative and not restrictive.

What is claimed is:
 1. A method, comprising: selectively applying atleast one layer of a securing coating over one or more of a plurality ofelements coupled with a framework associated with a wearable device, theplurality of elements including at least a sensor; selectively forming afirst inner molding that covers all or substantially all of the at leastone layer of the securing coating, the plurality of elements, and theframework; performing an inspection of the first inner molding;responsive to the inspection resulting in a defect, removing the firstinner molding and selectively re-forming the first inner molding thatcovers all or substantially all of the at least one layer of thesecuring coating, the plurality of elements, and the framework;selectively forming a second inner molding that covers all orsubstantially all of the first inner molding; and selectively forming anouter molding of the wearable device, the outer molding covering all orsubstantially all of the second inner molding, the outer molding havingan exterior configured to be positioned in contact with skin when thewearable device is worn.
 2. The method of claim 1, wherein the outermolding comprises an anti-bacterial material.
 3. The method of claim 1,wherein the outer molding comprises an oleophobic material.
 4. Themethod of claim 1, wherein the outer molding is configured to protectagainst ultraviolet radiation.
 5. The method of claim 1, wherein theouter molding comprises a hydrophobic material.
 6. The method of claim1, wherein the outer molding is configured to provide a waterproof sealover the plurality of elements.
 7. The method of claim 1, wherein apattern is formed on the outer molding.
 8. The method of claim 1,further comprising performing another inspection of the outer molding todetermine if the outer molding is defective.
 9. The method of claim 8,further comprising: removing the outer molding after determining theouter molding is defective; and re-forming the outer molding.
 10. Themethod of claim 1, wherein the framework is comprised of a syntheticfiber.
 11. The method of claim 1, wherein the framework is formed usingcarbon fiber.
 12. The method of claim 1, wherein the framework iscomprised of one or more filaments.
 13. The method of claim 1, whereinthe framework is formed using a thermoplastic elastomer.
 14. The methodof claim 13, wherein the thermoplastic elastomer comprisespolypropylene.
 15. The method of claim 1, wherein at least one of thelayers in the at least one layer of the securing coating comprises acurable material.
 16. A method, comprising: selectively applying atleast one layer of a securing coating substantially over one or more ofa plurality of elements coupled with a framework associated with awearable device, the plurality of elements including at least a sensor;forming one or more inner moldings substantially over a subset or all ofthe framework, the at least one layer of the securing coating and theplurality of elements, after the selectively applying, at least one ofthe one or more inner moldings having a protective property; and formingan outer molding of the wearable device that covers all or substantiallyall of the one or more inner moldings, the outer molding having anexterior configured to be positioned in contact with skin when thewearable device is worn.
 17. The method of claim 16, wherein theplurality of elements are configured to perform an operation using datafrom the sensor.
 18. The method of claim 16, wherein the protectiveproperty comprises a property selected from the group consisting ofwaterproofing, water-resistance, being hydrophobic, being oleophobic,being anti-bacterial, and ultraviolet radiation (UV) resistant.
 19. Themethod of claim 16, wherein the at least one layer of the securingcoating is configured to protect the one or more of the plurality ofelements from damage occurring during the forming of the one or moreinner moldings.
 20. The method of claim 16, wherein at least one of thelayers in the at least one layer of the securing coating comprises acurable material.